Cooling apparatus for electronic components

Details Cooling apparatus for electronic components Cooling apparatus for electronic components

1996-10-15

1998-05-26

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165122, 165185, 257722, 415177, H05K 720

Patent

active

057576190

ABSTRACT:
A cooling apparatus for electronic components comprising a plurality of radiating fins formed in a heat sink which is in contact with the electronic components, where at least one pair of the radiating fins are formed in parallel with one another. A motor for driving a fan to air-cool the electronic components fits in a groove formed by the radiating fins such that the motor axis is in the longitudinal direction of the groove. A motor-body support is provided on the radiating fins so as to support the motor fitting in the groove. A printed board is connected to a terminal of the motor and set up on the upper ends of the radiating fins, and a holding ridge is formed on the printed board for fitting in the groove so as to cooperate with the motor-body supports in clamping the motor therebetween.

REFERENCES:
patent: 5309983 (1994-05-01), Bailey
patent: 5544013 (1996-08-01), Chiu
patent: 5582506 (1996-12-01), Hong
patent: 5583746 (1996-12-01), Wang
patent: 5584339 (1996-12-01), Hong

Affiliated with

Also associated with

Rating

Cooling apparatus for electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling apparatus for electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling apparatus for electronic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1969945