Cooling apparatus for electronic apparatus

Details Cooling apparatus for electronic apparatus Cooling apparatus for electronic apparatus

2005-10-25

2005-10-25

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S695000, C165S080400, C174S015100

Reexamination Certificate

active

06958910

ABSTRACT:
An electronic component that generates heat is enclosed in a body. A bottom panel forms a part of the body. A heat receiving portion is thermally connected to the electronic component. A heat radiating portion that radiates the heat received by the heat receiving portion forms a part of the bottom panel. A liquid cooling path, inside which liquid coolant is circulated, is thermally coupled to the heat receiving portion and the heat radiating portion.

REFERENCES:
patent: 5268817 (1993-12-01), Miyagawa et al.
patent: 5731952 (1998-03-01), Ohgami et al.
patent: 6141214 (2000-10-01), Ahn
patent: 6296048 (2001-10-01), Sauer
patent: 6333847 (2001-12-01), Katsui et al.
patent: 6377452 (2002-04-01), Sasaki et al.
patent: 6418017 (2002-07-01), Patel et al.
patent: 6477871 (2002-11-01), Shaw et al.
patent: 6483445 (2002-11-01), England
patent: 6519148 (2003-02-01), Nakagawa et al.
patent: 6594149 (2003-07-01), Yamada et al.
patent: 6625024 (2003-09-01), Mermet-Guyennet
patent: 6755626 (2004-06-01), Komatsu et al.
patent: 6809927 (2004-10-01), Ohashi et al.
patent: 2002/0018337 (2002-02-01), Nakamura
patent: 2002/0053421 (2002-05-01), Hisano et al.
patent: 2002/0141159 (2002-10-01), Bloemen
patent: 2003/0039097 (2003-02-01), Igarashi
patent: 0 834 795 (1998-04-01), None
patent: 07-049725 (1995-02-01), None
patent: 10-055227 (1998-02-01), None
patent: 2000-228128 (2000-08-01), None
patent: 2002-222026 (2002-08-01), None
patent: 2002-344186 (2002-11-01), None
patent: 2003-044169 (2003-02-01), None

Affiliated with

Also associated with

Rating

Cooling apparatus for electronic apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling apparatus for electronic apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling apparatus for electronic apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3464017