Cooling apparatus for dissipating heat from a heat source

Details Cooling apparatus for dissipating heat from a heat source Cooling apparatus for dissipating heat from a heat source

2006-01-17

2006-01-17

Ford, John K. (Department: 3753)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S080300, C165S104210, C165S185000, C165S121000, C361S700000, C361S697000, C257S722000, C257S715000

Reexamination Certificate

active

06986384

ABSTRACT:
A cooling device primarily for cooling, e.g., integrated circuits or other electronic devices during operation may include a heat sink portion having a plurality of cooling vanes and a heat pipe chamber. Both the cooling vanes and the heat pipe chamber may be integrally formed within the heat sink portion. Because the heat pipe chamber is integrally formed with the cooling vanes, no joints exist between the condensing surface of the heat pipe chamber and the cooling vanes. This, in turn, allows extremely rapid and efficient heat transfer between the heat pipe chamber and the cooling vanes. The cooling device may include extensions of the main heat pipe chamber which project into each of the cooling vanes. In this manner, the condensing surface of the heat pipe chamber is actually moved into the vanes at a position very close to the surface of the vanes where heat transfer into the atmosphere occurs.

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