Cooling apparatus for an electronics subsystem employing a...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C165S080400, C417S423100, C417S424100

Reexamination Certificate

active

11008732

ABSTRACT:
A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.

REFERENCES:
patent: 5039286 (1991-08-01), Point et al.
patent: 5131233 (1992-07-01), Cray et al.
patent: 5218515 (1993-06-01), Bernhardt
patent: 5924482 (1999-07-01), Edwards et al.
patent: 6019165 (2000-02-01), Batchelder
patent: 6305180 (2001-10-01), Miller et al.
patent: 6393853 (2002-05-01), Vukovic et al.
patent: 6408937 (2002-06-01), Roy
patent: 6498725 (2002-12-01), Cole et al.
patent: 6580609 (2003-06-01), Pautsch
patent: 6587345 (2003-07-01), Chu et al.
patent: 6604370 (2003-08-01), Bash et al.
patent: 6604571 (2003-08-01), Morrow et al.
patent: 6625023 (2003-09-01), Morrow et al.
patent: 6628520 (2003-09-01), Patel et al.
patent: 6991024 (2006-01-01), Goodson et al.
patent: 7104312 (2006-09-01), Goodson et al.
patent: 7131486 (2006-11-01), Goodson et al.
patent: 7184269 (2007-02-01), Campbell et al.
patent: 2003/0072656 (2003-04-01), Niwatsukino et al.
patent: 2004/0012914 (2004-01-01), Chu et al.
patent: 2004/0123614 (2004-07-01), Stewart
patent: 2005/0168079 (2005-08-01), Wos
patent: 2006/0082970 (2006-04-01), Walz et al.
“MEMS-Based Heat Exchanger Cools “Hot” CPUs,” www.graniteve.com, Granite Ventures, LLC, Sep. 29, 2003 (3 pgs.).
Catalog, “Microstructure Liquid Cooler: Outstanding Cooling Performance for Electronic Devices,” Atotech (2003) (6 pgs.).
Valenzuela, J.A., et al., “Cooling High Heat Flux Devices withMikrosMicrochannel Heat Sinks,” Mikros Manufacturing, Inc., Aug. 2003 (13 pgs).
Chu et al., “Thermal Dissipation Assembly and Fabrication Method for Electronics Drawer of a Multiple-Drawer Electronics Rack,” U.S. Appl. No. 10/675,628, filed Sep. 30, 2003.
Chu et al., “Cooling System and Method Employing At Least Two Modular Cooling Units for Ensuring Cooling of Multiple Electronics Subsystems,” U.S. Appl. No. 10/726,377, filed Dec. 13, 2003.
Chu et al., “Method System and Program Product for Automatically Checking Coolant Loops of a Cooling System for a Computing Environment,” U.S. Appl. No. 10/736,944, filed Dec. 16, 2003.
Chu et al., “Method System and Program Product for Monitoring Rate of Volume Change of Coolant Within a Cooling System,” U.S. Appl. No. 10/736,947, filed Dec. 16, 2003.
Campbell et al., “Cooling System and Method Employing Auxiliary Thermal Capacitor Unit for Facilitating Continuous Operation of an Electronics Rack,” U.S. Appl. No. 10/930,079, filed Aug. 31, 2004.

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