Heat exchange – With retainer for removable article – Electrical component
Patent
1994-11-15
1997-10-14
Leo, Leonard R.
Heat exchange
With retainer for removable article
Electrical component
165 804, 165 96, 165185, 174 163, 257714, 257722, 361691, 361699, 361707, 361719, F28F 700
Patent
active
056761988
ABSTRACT:
This invention relates to a cooling apparatus for at least one electronic component. The cooling apparatus includes a first member which has an inner surface and an outer surface. The outer surface of the first member is adapted for mounting the electronic component thereon at a preselected location. The cooling apparatus also includes a venturi member which is fixedly secured to the inner surface of the first member. The venturi member is positioned to direct a cooling fluid to flow in thermal communication with the inner surface of the first member. The venturi member is also positioned to control a flow velocity of the cooling fluid flowing in thermal communication with a preselected portion of the inner surface of the first member. The preselected portion of the inner surface of the first member is opposite to the preselected location of the outer surface of the first member.
REFERENCES:
patent: 2964688 (1960-12-01), McAdam
patent: 3437965 (1969-04-01), Ragsdale
patent: 4186422 (1980-01-01), Laermer
patent: 4366497 (1982-12-01), Block et al.
patent: 4587594 (1986-05-01), McPherson
patent: 4633371 (1986-12-01), Nagy et al.
patent: 4718163 (1988-01-01), Berland et al.
patent: 4765397 (1988-08-01), Chrysler et al.
patent: 4867235 (1989-09-01), Grapes et al.
patent: 4920574 (1990-04-01), Yamamoto et al.
patent: 4953634 (1990-09-01), Nelson et al.
patent: 4982274 (1991-01-01), Murase et al.
patent: 4984066 (1991-01-01), Iversen
patent: 5014117 (1991-05-01), Horvath et al.
patent: 5028989 (1991-07-01), Naganuma et al.
patent: 5072787 (1991-12-01), Nakamichi
patent: 5077601 (1991-12-01), Hatada et al.
patent: 5113315 (1992-05-01), Capp et al.
patent: 5212625 (1993-05-01), van Andel et al.
patent: 5218516 (1993-06-01), Collins et al.
patent: 5241452 (1993-08-01), Kitajo
patent: 5276584 (1994-01-01), Collins et al.
patent: 5293930 (1994-03-01), Pitasi
patent: 5304845 (1994-04-01), Lindquist et al.
Bland Timothy J.
Schneider Michael G.
Chapman Kristin L.
Leo Leonard R.
Sundstrand Corporation
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