Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
1999-06-14
2001-07-10
Lazarus, Ira S. (Department: 3743)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S104210, C361S700000, C257S715000
Reexamination Certificate
active
06257324
ABSTRACT:
CROSS REFERENCE TO THE RELATED APPLICATIONS
This application is based on Japanese Patent Application Nos. Hei. 10-184877 filed on Jun. 30, 1998, Hei. 10-233732 filed on Aug. 20, 1998, Hei. 10-278279 filed on Sep. 30, 1998, Hei. 10-284503 filed on Oct. 6, 1998, Hei. 11-5993 filed on Jan. 13, 1999, Hei. 11-6022 filed on Jan. 13, 1999, Hei. 11-6849 filed on Jan. 13, 1999, Hei. 11-6934 filed on Jan. 13, 1999, Hei. 11-6997 filed on January 13, and Hei. 11-7498 filed on Jan. 14, 1999, the contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a cooling apparatus for cooling a heating body by boiling and condensing a refrigerant repeatedly.
2. Description of Related Art
A conventional cooling apparatus is disclosed in Japanese Patent Application Laid-Open No. 8-236669. In this cooling apparatus, as shown in
FIG. 10
, a boiling area in a refrigerant tank
1100
for reserving a refrigerant is increased to improve the radiation performance by attaching a heating body
1110
to the surface of the refrigerant tank
1100
and by arranging fins
1120
to correspond to the boiling face in the refrigerant tank
1100
for receiving the heat of the heating body.
Here, in the above-specified cooling apparatus, the fins
1120
arranged in the refrigerant tank
1100
form a plurality of passage portions
1130
, in which the vaporized refrigerant (or bubbles), as boiled by the heat of the heating body
1110
, rises. At this time, as referred to
FIG. 5
, some of the individual passage portions
1130
have more and less numbers of bubbles in dependence upon the position of the heating portion of the heating body
1110
, and the number of bubbles increases the more for the higher position of the passage portions
1130
so that the small bubbles join together to form larger bubbles. In the passages of more bubbles, therefore, the boiling faces are covered with the more bubbles to lower the boiling heat transfer coefficient. As a result, the boiling face is likely to cause an abrupt temperature rise (or burnout).
Especially when the fin pitch is reduced to retain a larger boiling area, the passage portions
1130
are reduced in their average open area and are almost filled with the bubbles to reduce the quantity of refrigerant seriously so that the burnout may highly probably occur on the boiling faces.
Furthermore, in the cooling apparatus shown in
FIG. 10
, the fins
1120
arranged in the boiling portion form a plurality of passage portions
1130
, through which vapor (or bubbles), as boiled by the radiation of a heating body, rises in the boiling portion. At this time, the quantity of generated vapor becomes the more as the vapor rises to the higher level. When the boiling portion is vertically long so that the fins
1120
arranged in the boiling portion are long or when the heat generated by the heating body increases although the fins
1120
are not vertically long, therefore, the vapor (or bubbles) is hard to come out from the passage portions
1130
formed by the fins
1120
. As a result, the burnout becomes liable to occur on the upper side of the boiling portion so that the using range (or radiation) of the refrigerant tank
1100
is restricted.
Another conventional cooling apparatus is disclosed in Japanese Patent Application Laid-Open No. 8-204075. This cooling apparatus uses the principle of thermo-siphon and is constructed to include an evaporation portion
2100
for reserving a refrigerant and a condensation portion
2110
disposed over the evaporation portion
2100
, as shown in FIG.
43
. The vaporized refrigerant, as boiled in the evaporation portion
2100
by receiving heat of a heating body, flows into the condensation portion
2110
. After that, the refrigerant is cooled and liquefied by the heat exchange with the external fluid, and is recycled to the evaporation portion
2100
. By thus repeating the evaporation and condensation of the refrigerant, the heat of the heating body is transferred in the evaporation portion
2100
to the refrigerant and further to the condensation portion
2110
so that it is released to the external fluid at the condensation portion
2110
.
In the cooling apparatus in
FIG. 43
, however, the condensed liquid, as liquefied in the condensation portion
2110
, is returned to the evaporation portion
2100
via passages
2101
or returning passages
2102
of the evaporation portion
2100
. In the passages
2101
within the mounting range of the heating body, however, the vaporized refrigerant, as boiled by the heat of the heating body, rises so that the condensed liquid and the vaporized refrigerant interfere as the counter flows. As a result, the vaporized refrigerant becomes hard to leave the evaporation portion
2100
, and the condensed liquid flowing from the condensation portion
2110
into the evaporation portion
2100
is blown up by the vaporized refrigerant rising from the evaporation portion
2100
so that it becomes hard to return to the evaporation portion
2100
. As a result, a burnout (or an abrupt temperature rise) is liable to occur on the boiling faces of the evaporation portion
2100
, thus the radiation performance drops. By this problem, the drop in the radiation performance due to the burnout becomes the more liable to occur as the evaporation portion
2100
is thinned the more to reduce the quantity of precious refrigerant to be contained, from the demand for reducing the cost.
Still another conventional cooling apparatus is disclosed in Japanese Patent Application Laid-Open No. 9-126617. This cooling apparatus is used as a radiating device for an electric vehicle, and arranged inside a hood. Therefore, as shown in
FIG. 56
, in consideration of a mountability of inside hook in which arrangement space in a vertical direction is limited, a radiator
3100
is perpendicularly assembled to a refrigerant tank
3110
via a lower tank
3120
, and the refrigerant tank
3110
is arranged at a large inclination.
In the still another cooling apparatus in
FIG. 56
, since the refrigerant tank
3110
is largely inclined, a liquid refrigerant in the refrigerant tank
3110
may flows back to the radiator side when, for example, the vehicle stops suddenly or ascends a uphill road. Therefore, it is difficult for a boiling face of the refrigerant tank
3110
to be stably filled with liquid refrigerant. In such a situation, the boiling face is likely to occur a burnout (abrupt temperature rising), a radiation performance may largely decrease. Especially when the condensed liquid amount becomes the less as the refrigerant tank
3110
is thinned the more, the burnout of the boiling faces are likely occur.
Furthermore, in the still another cooling apparatus in
FIG. 56
, a plurality of heating bodies
3130
are attached in the longitudinal direction of the refrigerant tank
3110
. As bubbles are generated on the individual heating body mounting faces and sequentially flow downstream (to the radiator
3100
), therefore, the bubbles are the more in the refrigerant tank
3110
as they approach the closer to the radiator
3100
. This makes the more liable for the burnout to occur on the heating body mounting face the closer to the radiator
3100
. In order to prevent this burnout on the heating body mounting face closer to the radiator
3100
, on the other hand, it is necessary to enlarge the thickness size of the refrigerant tank
3110
thereby to increase its capacity. This increases the quantity of refrigerant to be reserved in the refrigerant tank
3110
, thus causing a problem to invite a high cost.
Further still another conventional cooling apparatus is disclosed in Japanese Patent Application Laid-Open No. 8-236669. This cooling apparatus forms a vaporized refrigerant outlet
4120
and a condensed liquid inlet
4130
by arranging a refrigerant control plate
4110
obliquely in the upper portion of a refrigerant tank
4100
, as shown in FIG.
81
. Thus, the vaporized refrigerant, as boiled in the refrigerant tank
4100
, can flow out along the refrigerant flow contro
Kamiya Kunihiro
Ohara Takahide
Osakabe Hiroyuki
Denso Corporation
Duong Tho
Harness Dickey & Pierce PLC
Lazarus Ira S.
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