Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-07-15
1999-12-07
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
16510433, 361699, H01L 2334
Patent
active
059988630
ABSTRACT:
According to the present invention, the cooling apparatus includes a refrigerant tank to which a semiconductor device is attached, a connection chamber which is open to the central portion of the refrigerant tank on the side opposite to the side where the semiconductor device is mounted, a first tube (a first radiator) having one end in communication with the connection chamber and the other end in communication with one end of the refrigerant tank, a second tube (a second radiator) having one end in communication with the connection chamber and the other end in communication with the other end of the refrigerant tank, and refrigerant contained in the refrigerant tank. Even when the cooling apparatus is inclined, at least one of the other end of the first tube and the other end of the second tube can be immersed below the liquid level of the refrigerant so that the refrigerant can circulate within the refrigerant tank efficiently.
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Kawaguchi Kiyoshi
Kobayashi Kazuo
Arroyo Teresa M.
Denso Corporation
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