Cooling apparatus and semiconductor device employing the same

Details Cooling apparatus and semiconductor device employing the same Cooling apparatus and semiconductor device employing the same

1988-04-07

1990-03-13

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 82, 361385, H01L 2334, H01L 2336, H01L 2346

Patent

active

049086952

ABSTRACT:
A heat conducting member is placed in the space between a semiconductor chip which generates heat and a heat transfer block which is cooled by a coolant, and the heat conducting member conducts heat from the semiconductor chip to the heat transfer block. The heat conducting member has a slanted surface which is inclined with respect to a surface to be cooled of the corresponding semiconductor chip. Even when the semiconductor chip is displaced or inclined with respect to the heat transfer block, the whole of the cooling surface of the semiconductor chip can be kept in contact with the corresponding heat conducting member.

REFERENCES:
patent: 4462462 (1984-07-01), Meagher et al.
patent: 4607277 (1986-08-01), Hassan et al.
patent: 4765400 (1988-08-01), Chu et al.
patent: 4770242 (1988-09-01), Daikoku et al.
patent: 4800956 (1989-01-01), Hamburgen

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