Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-02-27
2007-02-27
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S699000, C361S715000, C361S716000, C361S719000, C361S721000, C174S015100, C165S080400, C165S104330
Reexamination Certificate
active
11008359
ABSTRACT:
A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity. The heat exchange assembly defines a primary coolant flow path and a separate, secondary coolant flow path. The primary coolant flow path includes first and second chambers in fluid communication, and the secondary flow path includes a third chamber disposed between the first and second chambers. The heat exchange assembly provides a first thermal conduction path between primary coolant in the first chamber and secondary coolant in the third chamber, and a second thermal conduction path between primary coolant in the second chamber and secondary coolant in the third chamber. The heat exchange assembly further includes coolant nozzles to direct primary coolant towards the electronics devices.
REFERENCES:
patent: 5131233 (1992-07-01), Cray et al.
patent: 5515910 (1996-05-01), Hamilton et al.
patent: 5924482 (1999-07-01), Edwards et al.
patent: 6019165 (2000-02-01), Batchelder
patent: 6408937 (2002-06-01), Roy
patent: 6498725 (2002-12-01), Cole et al.
patent: 6587345 (2003-07-01), Chu et al.
patent: 6604370 (2003-08-01), Bash et al.
patent: 6604571 (2003-08-01), Morrow et al.
patent: 6625023 (2003-09-01), Morrow et al.
patent: 6793007 (2004-09-01), Kramer et al.
patent: 6828675 (2004-12-01), Memory et al.
patent: 6995980 (2006-02-01), Tustaniwskyj et al.
patent: 7000691 (2006-02-01), Weber
patent: 7043933 (2006-05-01), Knight
patent: 2003/0072656 (2003-04-01), Niwatsukino et al.
patent: 2004/0012914 (2004-01-01), Chu et al.
patent: 2004/0123614 (2004-07-01), Stewart
“MEMS-Based Heat Exchanger Cools “Hot” CPUs,” www.graniteve.com, Granite Ventures, LLC, Sep. 29, 2003 (3 pgs.).
Catalog, “Microstructure Liquid Cooler: Outstanding Cooling Performance for Electronic Devices,” Atotech (2003) (6 pgs.).
Valenzuela, J.A., et al., “Cooling High Heat Flux Devices withMikrosMicrochannel Heat Sinks,” μikros Manufactuing, Inc., Aug. 2003 (13 pgs.).
Chu et al., “Thermal Dissipation Assembly and Fabrication Method for Electronics Drawer of a Multiple-Drawer Electronics Rack,” U.S. Appl. No. 10/675,628, filed Sep. 30, 2003.
Chu et al., “Cooling System and Method Employing At Least Two Modular Cooling Units for Ensuring Cooling of Multiple Electronics Subsystems,” U.S. Appl. No. 10/726,377, filed Dec. 13, 2003.
Chu et al., “Method, System and Program Product for Automatically Checking Coolant Loops of a Cooling System for a Computing Environment,” U.S. Appl. No. 10/736,944, filed Dec. 16, 2003.
Chu et al., “Method, System and Program Product for Monitoring Rate of Volume Change of Coolant Within a Cooling System,” U.S. Appl. No. 10/736,947, filed Dec. 16, 2003.
Campbell et al., “Cooling System and Method Employing Auxiliary Thermal Capacitor Unit for Facilitating Continuous Operation of an Electronics Rack,” U.S. Appl. No. 10/930,079, filed Aug. 31, 2004.
Campbell Levi A.
Chu Richard C.
Ellsworth, Jr. Michael J.
Iyengar Madhusudan K.
Schmidt Roger R.
Chervinsky Boris
Esq. Lily Neff
Heslin Rothenberg Farley & & Mesiti P.C.
International Business Machines Company
Radigan, Esq. Kevin P.
LandOfFree
Cooling apparatus and method for an electronics module... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling apparatus and method for an electronics module..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling apparatus and method for an electronics module... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3892668