Cooling apparatus and method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S689000, C257S714000, C165S080400, C165S104330

Reexamination Certificate

active

11101934

ABSTRACT:
A Micro Blade is described for implementing an electronic assembly having a thin profile; it is a miniaturized stand-alone unit that is mechanically and thermally rugged, and connects to external components using a cable. The electronic assembly is preferably fabricated on a copper foil substrate including an interconnection circuit, a special assembly layer, and directly attached components. The components are preferably in bare die form, and are preferably attached using plated copper spring elements inserted into wells filled with solder. The copper foil substrate may be folded to form a compact system in package (SIP) inside of the Micro Blade. A jacket comprised of thermally conductive members is formed around the electronic assembly using hermetic seams. The Micro Blade is preferably cooled by immersion in water contained in a tank; the water is cooled and circulated using an external pumping system.

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