Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-09-11
2007-09-11
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S689000, C361S695000, C361S697000, C165S096000, C165S109100, C165S121000, C315S111910
Reexamination Certificate
active
11171682
ABSTRACT:
A cooling apparatus is provided with an electrostatic flow modifier to be complementarily positioned relative to a cooling fluid flow to modify at least one characteristic of the cooling fluid flow to enhance an amount of heat the cooling fluid flow removes from an electronic component.
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The Article: “Electrostatic Cooling of Electronic Packages”, IBM Technical Disclosure Bulletin, Jun. 1975, US vol. 18, Issue 1, pp. 101-102.
F. Yang et al., “Corona driven air propulsion for cooling of electronics,” XIIIth International Symposium on High Voltage Engineering, Netherlands 2003, Smit (ed.), ISBN 90-77017-79-8, pp. 1-4.
Beltman Willem M.
Jewell-Larsen Nels E.
Mongia Rajiv K.
Montgomery Stephen W.
Trautman Mark A.
Datskovskiy Michael
Intel Corporation
Schwabe Williamson & Wyatt P.C.
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