Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-02-24
2001-01-16
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C174S016100
Reexamination Certificate
active
06175494
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to a method of cooling an encapsulated type housing, and a cooling apparatus for an encapsulated type housing. More specifically, the present invention is directed to a low-cost cooling method/cooling apparatus for an encapsulated, or sealed type housing, while a cooling efficiency and a waterproof characteristic are increased, and a total number of components is minimized.
2. Description of the Related Art
Conventionally, for instance, Japanese Laid Open Patent Application (JP-A-Heisei 5-102687) and Japanese Laid Open Patent Application (JP-A-Heisei 7-113589) describe cooling apparatuses for the sealed, or encapsulated type housings such as a sealed type cabinet used for a radio communication appliance used in an outdoor field. That is, these patent applications describe the heatpipe type cooling apparatuses equipped with the heat collecting fins installed inside the housings, and also the heat radiating fins installed outside the housings.
FIG. 1A
is a front view for showing the conventional cooling apparatus for the sealed, or encapsulated type housing.
FIG. 1B
is a sectional view for showing this cooling apparatus, taken along a line III—III of FIG.
1
A.
FIG. 2
is a sectional view for representing this cooling apparatus, taken along a line II—II of FIG.
1
A.
In this conventional cooling apparatus, three sets of heatpipes
5
are provided on the upper unit of the housing. The operating temperatures of these heatpipes
5
are different from each other. The heat collecting fin
4
is provided on the inside of the housing
1
of the heatpipes
5
, whereas the heat radiating fin
4
a
is provided on the outside of the housing
1
.
This heatpipe
5
is constructed in the form of a heatpipe assembly for assembling the heat collecting fin
4
, the heat radiating fin
4
a
, the heat insulating material
1
a
, and the mounting plate
7
in an integral form. This heatpipe assembly is inserted into the housing
1
though a hole (not shown in detail). This hole is formed in the upper unit of the housing
1
, and has a shape corresponding to the shape of the heat insulating material
1
a
of this heat pipe assembly. The mounting plate
7
of the heatpipe assembly is screwed on this housing
1
. Furthermore, for example, this mounting plate
7
may be fixed by filling properly selected resin into a space formed in the hole. The sun-shade
6
is provided on the portion of this heatpipe assembly located at the outside from the housing
1
.
The above-described conventional cooling apparatus for the sealed type housing has the following problems. That is, since the heat radiating fin
4
a
is exposed to the outside portion of the sealed type housing
1
, this heat radiating fin
4
a
may absorb direct heat and/or radiation heat given from the sun. As a result, the internal temperature of this housing
1
would be conversely increased, contrary to its essential function of this heat radiating fin
4
a.
Moreover, the sealing distance between the housing
1
and the heat radiating fin
4
a
which is largely exposed to the outside of the housing
1
is very long, resulting in deteriorations of the water-proofing characteristics and drip-proofing characteristics of the housing
1
. In addition, since the size of the above-described hole is large, this may also cause the water-proofing/drip-proofing problems of the cooling apparatus. This hole formed in the upper unit of the housing
1
is employed to insert the heatpipe assembly into the housing
1
.
Also, this conventional cooling apparatus owns another problem. That is, the expensive heatpipe type cooling device is required. In addition, since a very large number of structural components are required in this heatpipe type cooling device, and also a total number of assembling stages for the heatpipe type cooling device is needed. Therefore, total cost of the cooling apparatus would be increased.
On the other hand, Japanese Laid Open Utility Model Application (JPU-A-Heisei 7-41262) discloses the following cooling construction. That is, this disclosed cooling construction is equipped with the heat radiating fin
2
of the heat pipe
1
, and the air duct
12
. This heat radiating fin
2
is located outside the housing
11
which contains the heat radiating source
10
. The air duct
12
is made in the continuous shape, and is used to exhaust air conducted thereinto from the housing
11
by contacting all amounts of this conducted air to the heat radiating fin
2
. This air duct
12
is installed outside the housing
11
. The heat radiating fin
2
is arranged at the upper portion of the penetration unit of the side wall of this housing
11
.
However, this conventional heatpipe type cooling structure could not also solve the above-explained problems.
Further, Japanese Laid Open Patent Application (JP-A-Heisei 7-83582) discloses the below-mentioned cooling apparatus. That is, in this conventional cooling apparatus, the zig-zag type narrow-tube heatpipe
2
is provided to penetrate the separator plate
1
. Both sides of the surface of this separator plate
1
are routed in the zig-zag path, so that the pin-fin group having a needle-point-holder shape is formed.
However, this conventional cooling apparatus could not also solve these problems.
SUMMARY OF THE INVENTION
The present invention has been made to solve the above-described problems of the conventional cooling apparatuses, and therefore, has an object to provide a cooling apparatus for a sealed, or encapsulated type housing. That is, this cooling apparatus is operable in a high heat cooling efficiency without employment of heatpipe type cooling devices and exposed type heat radiating members, while being adversely influenced by direct heating and/or radiation heating.
Also, another object of the present invention is to provide a cooling apparatus for a sealed, or encapsulated type housing. That is, in this cooling apparatus, since a sealing distance between a heat radiating member and a housing can be minimized, water-proofing/drip-proofing characteristics of this cooling apparatus can be improved. Moreover, this cooling apparatus can be easily manufactured in low cost, while requiring a limited number of structural components thereof, and being operable in the outdoor field.
In order to achieve an aspect of the present invention, a cooling apparatus for cooling a housing includes a heat radiating member provided in the housing and having a path formed to have an opening portion in an upper portion of the housing, a heat radiating unit provided in at least a part of a surface of the path of the heat radiating member and a heat absorbing unit provided in a peripheral portion of the heat radiating member, such that heat radiated from the heat radiating unit is removed via the path from the opening portion of the heat radiating member by a chimney effect.
In this case, the path is formed to extend along a substantially vertical direction of the housing.
Also in this case, the heat radiating member is formed in a substantially cylindrical shape, wherein the heat radiating unit is provided on an inner surface of the heat radiating member and wherein the heat absorbing unit is provided on an outer surface of the heat radiating member.
Further in this case, the heat radiating unit is formed to have a substantially concave shape or a substantially convex shape to increase a surface area of the path and wherein the heat absorbing unit is formed in a substantially convex shape.
In order to achieve another aspect of the present invention, the heat radiating member is formed in a substantially cylindrical shape, wherein the heat radiating unit has a concave portion and wherein the heat absorbing unit has a projecting portion.
In this case, the path has another opening portion in a lower portion of the housing in addition to the opening portion.
Also, in this case, the heat radiating member and the heat radiating unit are stored in the housing.
Further in this case, the housing is constructed of a plurality
NEC Corporation
Tolin Gerald
Young & Thompson
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