Cooling apparatus

Refrigeration – Using electrical or magnetic effect – Thermoelectric; e.g. – peltier effect

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Details

62 32, 1651091, 165DIG320, F25B 2102

Patent

active

058229930

DESCRIPTION:

BRIEF SUMMARY
DESCRIPTION

The present invention relates to a cooling apparatus. In particular, the present invention relates to a thermoelectric cooling apparatus.


FIELD OF THE INVENTION

It is known to use thermoelectric modules in cooling systems. A thermoelectric module is a known type of heat pump in which the passage of an electric current through the module causes one side of the module to be cooled and the opposite side of the module to be heated.
Thermoelectric modules are also known as Peltier cells or thermoelectric heat pumps. In International Patent Application No. PCT/AU92/00008 in the names of Hyco Pty Ltd and Poseidon Scientific Instruments Pty Ltd there is described and claimed a thermoelectric system comprising a thermoelectric heat pump having first and second opposed outer faces and a manifold defining a volume attached to at least one outer face of the thermoelectric heat pump. The or each manifold has a fluid inlet and a fluid outlet so that fluid flows through to the or each manifold.
The inlet and the outlet are connected to heat exchange means and fluid pump means is provided for circulating fluid between the or each manifold and the heat exchange means. The thermoelectric system of International Patent Application No. PCT/AU92/00008 is primarily intended for cooling applications such as refrigeration or air conditioning. In International Patent Application No. PCT/AU94/00039 there is described a thermoelectric cooling system with a novel type of manifold. This manifold has arrangements for increasing the velocity and/or turbulence of fluid flowing through the manifold such as spiral members or protuberances.
International Patent Application Nos. PCT/AU92/00008 and PCT/AU94/00039 both describe inter alia manifolds mounted to each face of the thermoelectric module. The manifolds feature small torturous paths for fluid to flow between the inlet and outlet tubes.
The entire disclosures of International Patent Application Nos. PCT/AU92/00008 and PCT/AU94/00039 are incorporated herein by reference.


SUMMARY OF THE INVENTION

It has now been discovered that the heat transfer between a thermoelectric module face and a cooling system can further be enhanced by the use of a manifold containing non-static means for increasing liquid turbulence.
In accordance with one aspect of the present invention there is provided a thermoelectric system characterised by a thermoelectric module heat pump having first and second opposed outer faces, the first outer face being relatively cool and the second outer face being relatively hot in use, a manifold defining a volume being attached to at least one outer face of the thermoelectric module, the manifold having a liquid inlet and a liquid outlet so that, in use, liquid flows through the manifold, wherein the manifold contains a non-static means for increasing turbulence in the liquid flowing therethrough so as to increase efficiency of heat transfer between the thermoelectric module and the liquid.
In accordance with another aspect of the present invention there is provided a thermoelectric module characterised by having electrically insulating heat conductive plates as its outer faces, the plates having a peripheral gap between them and this gap being sealed.


BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a side elevation of a thermoelectric system in accordance with the present invention;
FIG. 2 is a plan view of the thermoelectric system of FIG. 1;
FIG. 3 is a plan view of a thermoelectric module in accordance with the present invention as used in the system of FIGS. 1 and 2;
FIG. 4 is an end view looking from the direction of the arrow A in FIG. 3, and
FIG. 5 is a side view looking from the direction of the arrow B in FIG. 3.


DESCRIPTION OF THE INVENTION

In FIGS. 1 and 2 of the accompanying drawings, there is shown a thermoelectric system 10 in accordance with the present invention comprising a thermoelectric module 12. The thermoelectric mo

REFERENCES:
patent: 3212274 (1965-10-01), Eidus
patent: 3559437 (1971-02-01), Panas
patent: 4829771 (1989-05-01), Koslow et al.
patent: 5314586 (1994-05-01), Chen

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