Cooling apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S104330, C361S719000, C257S719000

Reexamination Certificate

active

07385818

ABSTRACT:
A cooling apparatus for cooling an electronic device on a substrate, comprising a first heat sink held in contact with the electronic device, but unconnected with the substrate or the electronic device. The first heat sink is held into contact with the electronic device by a biasing means.

REFERENCES:
patent: 5549155 (1996-08-01), Meyer et al.
patent: 5730210 (1998-03-01), Kou
patent: 6181559 (2001-01-01), Seo
patent: 6212074 (2001-04-01), Gonsalves et al.
patent: 6307748 (2001-10-01), Lin et al.
patent: 6366460 (2002-04-01), Stone et al.
patent: 6462951 (2002-10-01), Letourneau
patent: 6639800 (2003-10-01), Eyman et al.
patent: 6865082 (2005-03-01), Huang et al.
patent: 7215546 (2007-05-01), Hata et al.
patent: 2003/0192672 (2003-10-01), Lee et al.
patent: 20300300 (2003-03-01), None
patent: 20304781 (2003-07-01), None
patent: 20304782 (2003-08-01), None
patent: 2388473 (2003-11-01), None
patent: 2002280499 (2002-09-01), None
patent: WO 03088022 (2003-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Cooling apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2813601

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.