Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-06-10
2008-06-10
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S104330, C361S719000, C257S719000
Reexamination Certificate
active
07385818
ABSTRACT:
A cooling apparatus for cooling an electronic device on a substrate, comprising a first heat sink held in contact with the electronic device, but unconnected with the substrate or the electronic device. The first heat sink is held into contact with the electronic device by a biasing means.
REFERENCES:
patent: 5549155 (1996-08-01), Meyer et al.
patent: 5730210 (1998-03-01), Kou
patent: 6181559 (2001-01-01), Seo
patent: 6212074 (2001-04-01), Gonsalves et al.
patent: 6307748 (2001-10-01), Lin et al.
patent: 6366460 (2002-04-01), Stone et al.
patent: 6462951 (2002-10-01), Letourneau
patent: 6639800 (2003-10-01), Eyman et al.
patent: 6865082 (2005-03-01), Huang et al.
patent: 7215546 (2007-05-01), Hata et al.
patent: 2003/0192672 (2003-10-01), Lee et al.
patent: 20300300 (2003-03-01), None
patent: 20304781 (2003-07-01), None
patent: 20304782 (2003-08-01), None
patent: 2388473 (2003-11-01), None
patent: 2002280499 (2002-09-01), None
patent: WO 03088022 (2003-10-01), None
Hush Technologies Investments Ltd
Knobbe Martens Olson & Bear LLP
Thompson Gregory D
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