Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent
1991-06-28
1993-03-30
LaRoche, Eugene R.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
361382, 361385, 257712, 257714, 257715, 257717, 257722, 257730, H01L 2504, H01L 2346, H01L 2342
Patent
active
051988895
ABSTRACT:
A cooling apparatus for cooling a heat generating member by removing heat produced in the member comprises a cooling stud which is thermally jointed to the heat generating member, a woking fluid for removing the heat transmitted to the cooling stud by utilizing vaporization thereof, a condenser for condensing the vaporized fluid and providing the liquid phase fluid to the cooling stud, and a passage through which the liquid phase fluid passes while vaporizing to remove the heat, the liquid phase fluid being provided to the passage in the cooling stud by the condenser device.
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Japanese Patent Publication; Japan Heat Transfer Symposium, Jun. 25, 1988; S. Yoshikawa et al; "A Method of seepage cooling by using water as a coolant".
Japanese Patent Publication; Japan Heat Transfer Symposium, Jun. 17, 1990; S. Yoshikawa et al; "Research of seepage cooling".
Hisano Katsumi
Ishizuka Masaru
Sasaki Tomiya
Kabushiki Kaisha Toshiba
LaRoche Eugene R.
Nguyen Viet Q.
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