Cooling an integrated circuit die with coolant flow in a...

Details Cooling an integrated circuit die with coolant flow in a... Cooling an integrated circuit die with coolant flow in a...

2004-03-29

2009-12-15

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S704000, C361S705000

Reexamination Certificate

active

07633752

ABSTRACT:
An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.

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