Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-03-14
2008-07-08
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S700000, C361S704000, C165S104330, C174S015200
Reexamination Certificate
active
07397667
ABSTRACT:
A cooler module mounted on a CPU on a circuit board inside a computer is disclosed to include a mounting base frame, which is made of a thermal conductive material and has a heat-transfer zone disposed in contact with the CPU and two arms respectively extended from two sides of the heat-transfer zone and affixed to the circuit board and two eyelet lugs vertically extended from two sides of the distal end of one of the two arms, a heat pipe, which has one end supported on the heat-transfer zone of the mounting base frame, an elongated retaining member, which has two lugs disposed at one end thereof and respectively fastened to the eyelet lugs of the mounting base frame, and a buffer member fastened to the heat-transfer zone to hold down heat pipe on the heat-transfer zone.
REFERENCES:
patent: 7327574 (2008-02-01), Frank et al.
patent: 2007/0236885 (2007-10-01), Zhao et al.
patent: 2007/0253769 (2007-11-01), Hwang et al.
Hsiao Wei-Chung
Lin Chun-Hung
Wang Hsuan-Cheng
Wu Tsung-Hui
Chow Ming
Compal Electronics Inc.
Gandhi Jayprakash N
Hoffberg Robert J
Sinorica LLC
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