Cooler for cooling both sides of semiconductor device

Details Cooler for cooling both sides of semiconductor device Cooler for cooling both sides of semiconductor device

2007-06-19

2007-06-19

Flanigan, Allen J. (Department: 3744)

Heat exchange

With repair or assembly means

C165S080400, C165S083000, C361S699000

Reexamination Certificate

active

10733472

ABSTRACT:
An object of the present invention is to provide a cooler for cooling both sides (top and bottom surfaces) of a semiconductor device, wherein the variation of pressing force on flat cooling tubes holding a semiconductor device is reduced, thereby uniformly dissipating the heat generated by the semiconductor device. When the holding plates press the flat cooling tubes and semiconductor modules by tightening the nut, the dimensional tolerances in the stacking direction are absorbed by the deformable portions in the inlet and outlet headers. A spacer may be employed inside the flat cooling tubes in order to suppress the deformation of the flat cooling tubes along the stacking direction.

REFERENCES:
patent: 3921201 (1975-11-01), Eisele et al.
patent: 4420739 (1983-12-01), Herren
patent: 4443921 (1984-04-01), Allemandou
patent: 4570700 (1986-02-01), Ohara et al.
patent: 4578745 (1986-03-01), Olsson
patent: 2001/0033477 (2001-10-01), Inoue et al.
patent: A 6-291223 (1994-10-01), None
patent: A 2001-320005 (2001-11-01), None
patent: A-2002-343916 (2002-11-01), None

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