Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-07-07
2001-05-08
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C024S458000, C257S719000, C248S510000, C361S710000, C361S719000
Reexamination Certificate
active
06229703
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a cooler device, especially a cooler device adapted to be attached to a CPU module for effectively dissipating heat generated from the CPU module.
2. The Prior Art
A mother board of a personal computer has many components mounted thereon. Most of these components generate heat during operation, therefore, a fan is usually installed on the mother board for dissipating heat.
Since modulation has become a trend in the PC industry, a CPU is often configured with other components in a module box, therefore, a CPU module of this combination further requires a specific heat sink to dissipate heat in addition to the fan.
Considering the cost and efficiency heat dissipation, a simple and effective cooler device is earnestly required. In the conventional cooler device, such as U.S. Pat. No. 5,486,981 discloses a single-piece clip attaching to a heat sink for dissipating heat from the related CPU module. This clip requires complicated bending procedure to manufacture and it lacks of sufficient engagement with the heat sink therefore it can not meet the cost-down and simplicity trends. In Taiwan patent No. 313,278 another clip including four parts is disclosed, which is difficult to be assembled and does not meet the cost-down and simplicity requirement. It is requisite to provide a new cooler device which can solve the above problems.
SUMMARY OF THE INVENTION
The primary purpose of the present invention is to provide an improved cooler device having a one-piece clip attached to a heat sink for achieving cost-down and simplicity requirement.
In accordance with one aspect of the present invention, a cooler device for fixing a CPU module on a printed circuit board comprises a heat sink having a base and a plurality of fins extending upward from the base and adjacent fins and a portion of the base therebetween defining a reception space. A clip is sized to be retained in one of the reception spaces between adjacent fins and includes a U-shaped portion having a first horizontal portion, two second horizontal portions extending from two ends of the U-shaped portion, and two vertical portions extending downward from the second horizontal portions and respectively forming a boardlock at the end thereof for engaging to the printed circuit board, thereby forcing the first horizontal portion of the U-shaped portion to abut against the base of the heat sink.
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Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Thompson Gregory
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