Metal founding – Process – Shaping a forming surface
Reexamination Certificate
2007-06-07
2011-11-29
Nguyen, Sang (Department: 2886)
Metal founding
Process
Shaping a forming surface
C164S045000, C164S369000
Reexamination Certificate
active
08066052
ABSTRACT:
A casting includes a wall thickness check feature for measuring thickness of a wall second aside an in-wall cooling passageway. The thickness is determined by observing the existence and/or size of an opening formed by the feature. The casting is cast from a pattern including portions forming the feature. To manufacture the pattern, a pattern-forming die is assembled with a ceramic feedcore and a refractory metal core (RMC). The assembling leaves an inlet portion of the RMC engaged to the ceramic feedcore and leaves an outlet portion of the RMC engaged to the die. A pattern-forming material is molded in the die at least partially over the ceramic feedcore and RMC. The die is disengaged from the pattern-forming material. The assembling engages a stepped projection of the RMC with a mating surface of the die.
REFERENCES:
patent: 5090866 (1992-02-01), Blair
patent: 5296308 (1994-03-01), Caccavale et al.
patent: 6607355 (2003-08-01), Cunha et al.
patent: 6637500 (2003-10-01), Shah et al.
patent: 6805535 (2004-10-01), Tiemann
patent: 6929054 (2005-08-01), Beals et al.
patent: 7014424 (2006-03-01), Cunha et al.
patent: 7134475 (2006-11-01), Snyder et al.
patent: 7144220 (2006-12-01), Marcin, Jr.
patent: 7172012 (2007-02-01), Memmen
patent: 7185695 (2007-03-01), Santeler
patent: 7207374 (2007-04-01), Persky et al.
patent: 7216689 (2007-05-01), Verner et al.
patent: 7306024 (2007-12-01), Beals et al.
patent: 7322795 (2008-01-01), Luczak et al.
patent: 7686068 (2010-03-01), Tholen et al.
patent: 2006/0118262 (2006-06-01), Beals et al.
patent: 2006/0239819 (2006-10-01), Albert et al.
patent: 2007/0044934 (2007-03-01), Santeler
patent: 1923153 (2008-05-01), None
EP Office Action for European Patent Application No. 08251980.2, dated Apr. 29, 2010.
Bachman & LaPointe P.C.
Nguyen Sang
United Technologies Corporation
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