Cooled stack of electrically isolated semiconductors

Details Cooled stack of electrically isolated semiconductors Cooled stack of electrically isolated semiconductors

1985-05-24

1986-12-23

Davie, James W.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 80, 357 81, 357 75, 174 15HP, 174 16HS, 361381, 361382, 165 804, 165 805, H04N 902, H02B 100, F28F 700, H01B 734

Patent

active

046315730

ABSTRACT:
Electrical isolation of semiconductors in a stack with interposed heat sinks is attained through the use of a thin sheet 30 of electrical insulating material disposed between first and second, electrically conductive heat sink elements 26, 28, each having a planar surface 32, 34 and an opposite surface 12, 14 configured to make good electrical and thermal contact with a semiconductor 16, 18, 20. Each heat sink element 26, 28 has a pair of ports 42, 44, 46 that may act as inlets or outlets and an internal conduit 54 interconnecting the same. The conduit 54 is in heat transfer relation to the sides 12 and 14 and the elements 26, 28 sandwich the sheets 30 between the planar sides 32 and 34. Adhesive 88, 90 bonds the planar surfaces 32 and 34 to the sheet 30.

REFERENCES:
patent: 3509429 (1970-04-01), Craig et al.
patent: 3771031 (1973-11-01), Kay
patent: 4268850 (1981-05-01), Lazarek et al.
patent: 4392153 (1983-07-01), Glascock, II et al.

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