Cooled semiconductor power module including structured strain bu

Details Cooled semiconductor power module including structured strain bu Cooled semiconductor power module including structured strain bu

1978-11-06

1983-07-05

James, Andrew J.

Metal fusion bonding

Process

Critical work component, temperature, or pressure

357 65, 357 68, 357 79, 228193, H01L 2504, H01L 2348, H01L 2944

Patent

active

043921531

ABSTRACT:
A semiconductor electronic device operates at high power levels using structured copper to reduce generation of stress between the elements of the device during thermal cycling in the course of normal operation. Structured copper strain buffers are used to attach each side of a silicon wafer to fluid cooled heat sinks to provide efficient removal of heat generated by the device and good electrical connection to the silicon wafer.

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