Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-06-12
2007-06-12
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S698000, C361S699000, C361S719000, C257S714000, C165S080400
Reexamination Certificate
active
11155371
ABSTRACT:
A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated-circuit device carrier. The molding material is molded to the device, to the liquid pump, and to the integrated-circuit device carrier. The cover has a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material. The coolant channel and the heat exchanger together at least partially define a closed coolant circuit. The liquid pump is operatively connected to the closed coolant circuit. A method for cooling a printed circuit board includes placing a liquid coolant in the closed coolant circuit and electrically activating the liquid pump through the printed circuit board.
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EP Search Report Dated Jul. 12, 2006.
Flip Chips Kulicke & Soffa Practical Dummy Components http://www.practicalcomponents.com/flipchip.htm.
Brandenburg Scott D.
Chengalva Suresh K.
Datskovskiy Michael
Delphi Technologies Inc.
Funke Jimmy L.
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