Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-09-12
2006-09-12
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C257S675000, C257S706000, C257S707000, C257S718000
Reexamination Certificate
active
07106592
ABSTRACT:
A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.
REFERENCES:
patent: 3436603 (1969-04-01), Vogt
patent: 3603381 (1971-09-01), Scherbaum et al.
patent: 3652903 (1972-03-01), Eriksson et al.
patent: 3921201 (1975-11-01), Eisele et al.
patent: 4142577 (1979-03-01), Klein
patent: 4178630 (1979-12-01), Olsson
patent: 4268850 (1981-05-01), Lazarek et al.
patent: 4392153 (1983-07-01), Glascock, II et al.
patent: 4578745 (1986-03-01), Olsson
patent: 4841355 (1989-06-01), Parks
patent: 5043797 (1991-08-01), Lopes
patent: 5229915 (1993-07-01), Ishibashi et al.
patent: 5396403 (1995-03-01), Patel
patent: 5489802 (1996-02-01), Sakamoto et al.
patent: 5821161 (1998-10-01), Covell et al.
patent: 5874774 (1999-02-01), Takahashi
patent: 5907474 (1999-05-01), Dolbear
patent: 5966290 (1999-10-01), Sammakia et al.
patent: 5990549 (1999-11-01), Chiu et al.
patent: 6014313 (2000-01-01), Hesselbom
patent: 6025992 (2000-02-01), Dodge et al.
patent: 6072240 (2000-06-01), Kimura et al.
patent: 6072697 (2000-06-01), Garcia-Ortiz
patent: 6073683 (2000-06-01), Osakabe et al.
patent: 6084771 (2000-07-01), Ranchy et al.
patent: 6144101 (2000-11-01), Akram
patent: 6181007 (2001-01-01), Yamazaki et al.
patent: 6215185 (2001-04-01), Kikuchi et al.
patent: 6303974 (2001-10-01), Irons et al.
patent: 6320268 (2001-11-01), Lang et al.
patent: 6333849 (2001-12-01), Donahoe et al.
patent: 6349035 (2002-02-01), Koenen
patent: 6351387 (2002-02-01), Prasher
patent: 6380622 (2002-04-01), Hirai et al.
patent: 6495924 (2002-12-01), Kodama et al.
patent: 6496375 (2002-12-01), Patel et al.
patent: 4322665 (1994-01-01), None
patent: 2721438 (1995-12-01), None
patent: 355123154 (1980-09-01), None
patent: A-55-162250 (1980-12-01), None
patent: A-57-186345 (1982-11-01), None
patent: A-58-34951 (1983-03-01), None
patent: A-58-165349 (1983-09-01), None
patent: A-59-119858 (1984-07-01), None
patent: A-61-279158 (1986-12-01), None
patent: 361279158 (1986-12-01), None
patent: A-62-92349 (1987-04-01), None
patent: A-62-252957 (1987-11-01), None
patent: 363096946 (1988-04-01), None
patent: A-1-201942 (1989-08-01), None
patent: 2-89352 (1990-03-01), None
patent: 5-55419 (1993-03-01), None
patent: 405082687 (1993-04-01), None
patent: 06-37219 (1994-10-01), None
patent: 6-291223 (1994-10-01), None
patent: 8-008395 (1996-01-01), None
patent: A-9-307039 (1997-11-01), None
patent: A-10-56131 (1998-02-01), None
patent: A-63-96946 (1998-04-01), None
patent: A-11-87585 (1999-03-01), None
patent: 11-146507 (1999-05-01), None
patent: A-11-297910 (1999-10-01), None
patent: 11-346480 (1999-12-01), None
patent: 2000-174180 (2000-06-01), None
patent: 2001-308263 (2001-11-01), None
patent: 2002-26251 (2002-01-01), None
Inoue Seiji
Ohkouchi Yasuyuki
Chervinsky Boris
Oliff & Berridg,e PLC
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