Cool melt glue

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

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Details

524274, 524487, 526331, C08L 3104, C08L 9108, C08L 9304

Patent

active

050414828

ABSTRACT:
Hot-melt adhesives, useful for both glue-port and glue-gun applications, are formulated so that they can be applied at temperatures no higher than 280.degree. F. and preferably at temperatures of at most 250.degree. F. The adhesive compositions have a heat resistance of at least 125.degree. F. and are readily shaped into glue sticks for use in glue guns. The adhesive for the hot-melt adhesive compositions is suitably compounded with tackifyin resin and/or wax. The resulting composition has a shape viscosity profile, which is readily achieved, e.g., by using a high melt index adhesive polymer as an essential component.

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Abstract of Japanese Patent 57-067678, 4/82, Nippon Petro Chem. K. K.

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