Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Chamber enclosing work during bonding and/or assembly
Reexamination Certificate
2005-12-06
2005-12-06
Rossi, Jessica (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Chamber enclosing work during bonding and/or assembly
C156S351000, C156S362000, C156S363000, C156S367000, C156S538000, C156S556000, C156S566000, C156S580000, C156S583100, C156S583300
Reexamination Certificate
active
06971429
ABSTRACT:
An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under vacuum, heat and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (200) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained. Featured is a conveyorized vacuum applicator (12) comprising two independent vacuum lamination chambers (18,20) in end-to-end relation. The first vacuum chamber operates at ambient temperature to draw off all of the air entrapped between the dry film resist and the surface of the printed circuit board at conditions that do not result in premature tacking of the dry film to the surface of the board. Then, in the second vacuum chamber, the photoresist-forming layer is immediately laminated to the printed circuit board under heat and mechanical pressure. The forgoing reduces or eliminates common lamination defects such as premature resist tacking and the attendant need to repair or rework the printed circuit board.
REFERENCES:
patent: 4127436 (1978-11-01), Friel
patent: 4281922 (1981-08-01), Matsumoto
patent: 4659419 (1987-04-01), Miyake
patent: 4743325 (1988-05-01), Miyake
patent: 4889790 (1989-12-01), Roos et al.
patent: 4927733 (1990-05-01), Stout
patent: 4946524 (1990-08-01), Stumpf et al.
patent: 4992354 (1991-02-01), Axon et al.
patent: 5164284 (1992-11-01), Briguglio et al.
patent: 5292388 (1994-03-01), Candore
patent: 5557844 (1996-09-01), Bhatt et al.
patent: 5863447 (1999-01-01), Coteus et al.
patent: 6041840 (2000-03-01), Ogawa
patent: 6104475 (2000-08-01), Cook et al.
patent: 40 18 177 (1991-12-01), None
patent: 4026802 (1992-02-01), None
patent: 392226 (1990-10-01), None
patent: 460 621 (1991-12-01), None
patent: 1 078 735 (2001-02-01), None
patent: 1 078 734 (2002-02-01), None
patent: 2-226152 (1990-09-01), None
patent: 3-179449 (1991-05-01), None
patent: 4-39038 (1992-02-01), None
patent: 2001-171005 (2001-06-01), None
Patent Abstracts of Japan; vol. 015, No. 433 (P-1271), Nov. 5, 1991 & JP 03 179449 A (Hakutou KK; Others: 01), Aug. 5, 1991 & Database WPI, Derwent Publications Ltd., London, GB; AN 1991-271081 & JP 03 179449 A (Hakuto), Aug. 5, 1991 *abstract*.
Keil Charles R
Novello Osvaldo
Stanich Roberto
Piskorski John J.
Rossi Jessica
Shipley Company L.L.C.
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