Conveyorized plating line and method for electrolytically...

Details Conveyorized plating line and method for electrolytically... Conveyorized plating line and method for electrolytically...

2003-03-17

2008-11-11

Wilkins, III, Harry D (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S230200, C204S230700

Reexamination Certificate

active

07449089

ABSTRACT:
To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plated printed circuit boards are proposed which provide measures for reducing an electric voltage that builds up between adjacent printed circuit boards being conveyed through the line.

REFERENCES:
patent: 3643670 (1972-02-01), Sabatka et al.
patent: 4776939 (1988-10-01), Blasing et al.
patent: 4959137 (1990-09-01), Matsuoka et al.
patent: 5024732 (1991-06-01), Hubel
patent: 5292424 (1994-03-01), Blasing et al.
patent: 3236545 (1983-05-01), None
patent: 3624481 (1988-01-01), None
patent: 1160846 (2001-12-01), None
Patent Abstracts of Japan, vol. 009, No. 241, Sep. 27, 1985, Shin Nippon Seitetsu.

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