Convex profile anode for electroplating system

Details Convex profile anode for electroplating system Convex profile anode for electroplating system

2006-03-21

2006-03-21

Bell, Bruce F. (Department: 1746)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S280000, C204S292000

Reexamination Certificate

active

07014739

ABSTRACT:
An electroplating anode including a substantially convex oxidizing surface for oxidation of metal atoms in a semiconductor wafer electroplating process. The electroplating anode of the present invention substantially prolongs the lifetime of the anode and contributes to the prevention of wafer contamination due to generation of potential wafer-contaminating precipitate particles during a wafer electroplating process.

REFERENCES:
patent: 5443707 (1995-08-01), Mori
patent: 6113759 (2000-09-01), Uzoh
patent: 6391168 (2002-05-01), Ueno

Affiliated with

Also associated with

Rating

Convex profile anode for electroplating system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Convex profile anode for electroplating system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Convex profile anode for electroplating system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3601564