Convex/concave pattern-forming stamp, convex/concave...

Printing – Embossing or penetrating – Special-article machines

Reexamination Certificate

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C264S293000, C264S320000

Reexamination Certificate

active

10923728

ABSTRACT:
A convex/concave pattern-forming stamp which is capable of making recesses of a convex/concave pattern uniform in depth and preventing deformation and peeling of portions of the convex/concave pattern at the same time. The stamp has on a surface thereof an annular area formed with protrusions for forming a convex/concave pattern in a resin layer on a surface of a disk-shaped substrate by being pressed against the resin layer. Protrusions for dispersing a pressure applied to the resin layer when the stamp is pressed against the resin layer are formed in at least one of an outer area located radially outward of the annular area and an inner area located radially inward of the annular area.

REFERENCES:
patent: 5772905 (1998-06-01), Chou
patent: 5820794 (1998-10-01), Jung
patent: 6514437 (2003-02-01), Higashida et al.
patent: 6748865 (2004-06-01), Sakurai et al.
patent: 2002/0191317 (2002-12-01), Yasunaga
patent: 2004/0227263 (2004-11-01), Gorczyca et al.
patent: 2005/0001343 (2005-01-01), Komaki et al.
patent: 1393853 (2003-01-01), None
patent: 1-196749 (1989-08-01), None
patent: 6-212457 (1994-08-01), None
patent: 10302256 (1998-11-01), None
patent: 10308020 (1998-11-01), None
patent: 2000331333 (2000-11-01), None
patent: 2001-250217 (2001-09-01), None
patent: 2001312844 (2001-11-01), None
patent: 2002-100038 (2002-04-01), None
patent: 2002-100079 (2002-04-01), None
patent: 2003-006944 (2003-01-01), None
patent: 2003-157520 (2003-05-01), None
patent: 2003-217187 (2003-07-01), None
patent: 2003203333 (2003-07-01), None
patent: 2003217187 (2003-07-01), None
patent: 2004-504718 (2004-02-01), None
patent: 02/07199 (2002-01-01), None
Machine translation of JP 2003217187 to Yamamoto et al. from Japanese Patent Office website.
Machine translation of JP 2000-331333 to Igari from Japanese Patent Office website.
S.Y. Chou et al., Applied Physics Letters (US), vol. 67, No. 21, Nov. 20, 1995, pp. 3114-3116.
English Language Abstract of JP 1-196749.
English language Abstract of JP 2001-250217.
English language Abstract of JP 2002- 100038.
English language Abstract of JP 2002-100079.
English language Abstract of JP 2003-157520.
English language Abstract of JP 6-212457.
English language Abstract of JP 2003-226944.
English language Abstract of JP 2003-217187.

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