Plastic and nonmetallic article shaping or treating: processes – Direct application of electrical or wave energy to work – Polymerizing – cross-linking – or curing
Reexamination Certificate
2004-10-20
2008-09-23
Gupta, Yogendra (Department: 1791)
Plastic and nonmetallic article shaping or treating: processes
Direct application of electrical or wave energy to work
Polymerizing, cross-linking, or curing
C062S407000, C425S174400
Reexamination Certificate
active
07427374
ABSTRACT:
A convection cooling technique for selective deposition modeling utilizing a venturi duct to establish a low-pressure port for drawing a second flow of air into the duct. The second flow of air is drawn across a heat generating component in the selective deposition modeling apparatus. A low-pressure zone is established at the low-pressure port sufficient to meet the head loss that results when drawing the second flow across the heat generating component and into the venturi duct. A desired flow rate is achieved at a pressure drop that is greater than that possible by the direct use of a fan. The cooling system is well suited for use in providing steady state cooling of radiation exposure systems used in selective deposition modeling to initiate curing of the layers of dispensed material.
REFERENCES:
patent: 4178764 (1979-12-01), Rowe
patent: 4934920 (1990-06-01), Yamauchi et al.
patent: 4967832 (1990-11-01), Porter
patent: 5136515 (1992-08-01), Helinski
patent: 5204055 (1993-04-01), Sachs et al.
patent: 5216616 (1993-06-01), Masters
patent: 5322651 (1994-06-01), Emmer
patent: 5340433 (1994-08-01), Crump
patent: 5380769 (1995-01-01), Titterington et al.
patent: 5555176 (1996-09-01), Menhennett et al.
patent: 5855836 (1999-01-01), Leyden et al.
patent: 5866058 (1999-02-01), Batchelder et al.
patent: 6133355 (2000-10-01), Leyden et al.
patent: 6253834 (2001-07-01), Sterner
patent: 6259962 (2001-07-01), Gothait
patent: 6722872 (2004-04-01), Swanson et al.
patent: 2002/0016386 (2002-02-01), Napadensky
patent: 2003/0063138 (2003-04-01), Varnon et al.
patent: 2003/0083771 (2003-05-01), Schmidt
patent: 2003/0092820 (2003-05-01), Schmidt et al.
patent: 2003/0209836 (2003-11-01), Sherwood
patent: 2004/0104515 (2004-06-01), Swanson et al.
patent: 0 998 180 (2000-05-01), None
patent: WO 97/11837 (1997-04-01), None
patent: WO 00/11092 (2000-03-01), None
patent: WO 01/26023 (2001-04-01), None
patent: WO 01/68375 (2001-09-01), None
Article entitled, “A Novel Electronic Cooling Concept,” by R. Ponnappan and J. E. Bean, published at http://asp.nerac.com/caccess/WNDABSM?SESSION=D70816D70816D90033028F&STITEM=0004&A dated May 1, 2002.
Article entitled, “Thermal Management Research Studies, vol. 1. Electronics,” by R. Ponnappan, published at http://asp.nerac.com/caccess/WNDABSM?SESSION=D70816D90033028F&ndn=013036157852 dated May 1, 2002.
Article entitled, “Efficient Cooling of MCT and IGBT Using Venturi Flow,” by P. R. Ponnappan, J. E. Leland, J. E. Beam, G. Fronista, and J. A. Weimer, published at http://asp.nerac.com/caccess/WNDABSM?SESSION=D70816D90033028F&ndn=108062198250 dated May 1, 2002.
Article entitled, “Analysis of Conjugate Heat Transfer in a Venturi-Based Cooling System for High Heat-Flux Sources,” by V. Shanmugasundaram, J.E. Leland, J.E. Beam, and R. Ponnappan, published at http://asp.nerac.com/caccess/WNDABSM?SESSION=D70816D90033028F&ndn=108062195698 dated May 1, 2002.
Article entitled, “Active Cooling of MCT Using Venturi Flow,” by R. Ponnappan, J. E. Leland, W.S. Chang, J.E. Beam, B.T. Nguyen, and J.A. Weimer, published at http://asp.nerac.com/caccess/WNDABSM?SESSION=D70816D90033028F&ndn=108059377165 dated May 1, 2002.
3-D Systems, Inc.
D'Alessandro Ralph
Gupta Yogendra
Luk Emmanuel S
Roberson Keith
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