Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Involving measuring – analyzing – or testing
Reexamination Certificate
2011-03-29
2011-03-29
Neckel, Alexa D. (Department: 1723)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Involving measuring, analyzing, or testing
C204S228700
Reexamination Certificate
active
07914657
ABSTRACT:
Embodiments of the present invention pertain to controlling thickness of wafers during electroplating process. Information pertaining to an old current used during an electroplating process of a previous wafer is received. Information pertaining to the thickness of the previous wafer is received. A new current is automatically determined. The new current is to be used during an electroplating process for a new wafer. The new current is determined based on the information pertaining to the old current and the information pertaining to the thickness of the previous wafer.
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Fu Wai B.
Lam Hieu
Mehdizadeh Shahram Y.
Wong Yeak-Chong
Hitachi Global Storage Technologies - Netherlands B.V.
Neckel Alexa D.
Smith Nicholas A.
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