Controlling signal trace characteristic impedance via a conducti

Details Controlling signal trace characteristic impedance via a conducti Controlling signal trace characteristic impedance via a conducti

1997-11-26

2000-06-13

Lee, Benny

Wave transmission lines and networks

Coupling networks

With impedance matching

333238, 333247, 174250, 174260, 257664, 257728, 361736, 361748, 29846, H01P 308, H01P 502, H05K 118

Patent

active

060754230

ABSTRACT:
A conductive ground layer provides a low cost method of reducing, controlling, or tailoring printed circuit board (PCB), for example, a motherboard, trace impedance and/or size, cross-talk, and EMI without having to add additional layers. A thin layer of conductive epoxy is applied over a solder mask high speed signal trace area of the PCB. The conductive epoxy is connected to or coupled to a ground plane or layer of the PCB. The inclusion of a higher number of traces on the PCB is made possible by tailoring the characteristic impedance of the traces, which allows the trace size to be reduced.

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High Speed PC Band System Design (class), Part of University of California at Berkeley Site Training Program, by Lee W. Ritchey, Ritch Tech, Apr. and Sep. 1997.

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