Controlling method of forming thin film, system for said control

Details Controlling method of forming thin film, system for said control Controlling method of forming thin film, system for said control

1993-06-16

1995-04-25

Dang, Thi

Coating apparatus

Control means responsive to a randomly occurring sensed...

Responsive to condition of coating material

118712, 250205, 356381, G03F 700

Patent

active

054095387

ABSTRACT:
A method for irradiating a substrate such as a semiconductor substrate, coated with a photoresist, with light to measure variations in optical properties, such as reflectivity, refractive index, transmittance, polarization, spectral transmittance, for determining an optimum photoresist coating condition, an optimum photoresist baking condition, an optimum developing condition or an optimum exposure energy quantity, and forming a photoresist pattern according to the optimum condition. A system for the exposure method, a controlling method of forming a photoresist film by use of the exposure method, and a system for the controlling method, are useful for stabilization of the formation or treatment of the photoresist film, and ensure less variations in the pattern size. Furthermore, even in the case of a thin film other than a photoresist film, the formation or treatment of the thin film can be stabilized by measuring the optical property before and during or after the formation of the thin film and using the measurement results to control the condition for forming the thin film, the etching condition or the coating condition.

REFERENCES:
patent: 4308586 (1981-12-01), Coates
patent: 4500615 (1985-02-01), Iwai
patent: 4690528 (1987-09-01), Tanimoto et al.
patent: 4780747 (1988-10-01), Suzuki et al.
patent: 5250116 (1993-10-01), Tanimoto
"Patent Abstracts of Japan", vol. 9, No. 126 (E-318) (1849) 31 May, 1985; & JP-A-60 012 732 (Hitachi Seisakusho K.K.) 23 Jan. 1985.
"Patent Abstracts of Japan", vol. 9, No. 296 (P-407) 22 Nov. 1985; & JP-A-60 133 549 (Toshiba K.K.) 16 Jul. 1985.

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