Controlling impedances of an integrated circuit

Details Controlling impedances of an integrated circuit Controlling impedances of an integrated circuit

1998-09-29

1999-11-02

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438106, 438121, 438123, H01L 2144, H01L 2148, H01L 2150

Patent

active

059769114

ABSTRACT:
A semiconductor assembly includes two leads, a primary die and a secondary support structure. Impedance networks of the secondary support structure establish an impedance between each lead and a different bond pad of the primary die. Although the distances between each bond pad and lead are substantially different, the impedances between each bond pad and lead are substantially the same.

REFERENCES:
patent: 5532612 (1996-07-01), Liang
patent: 5561086 (1996-10-01), Rostoker
patent: 5789816 (1998-08-01), Wu

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