Computer-aided design and analysis of circuits and semiconductor – Integrated circuit design processing – Pcb – mcm design
Reexamination Certificate
2011-04-05
2011-04-05
Rossoshek, Helen (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Integrated circuit design processing
Pcb, mcm design
C716S100000, C716S101000, C716S132000, C716S136000, C174S250000, C174S251000, C174S254000
Reexamination Certificate
active
07921403
ABSTRACT:
Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a process of generating equalization data and a design structure for multilayer electronic structures is presented.
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Dangler John Richard
Doyle Matthew Stephen
International Business Machines - Corporation
Rossoshek Helen
Zehrer Matthew C.
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