Controlled zone solder dispensing

Details Controlled zone solder dispensing Controlled zone solder dispensing

1996-04-01

1998-04-28

Ramsey, Kenneth J.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

22818021, B23K 306

Patent

active

057434573

ABSTRACT:
A solder dispensing apparatus for depositing fluid solder into and around a pin-in-through-hole joining zone of an electronic circuit board which comprises:

REFERENCES:
patent: 989818 (1911-04-01), Smith
patent: 3025817 (1962-03-01), Switch
patent: 5133120 (1992-07-01), Kawakami et al.
patent: 5191709 (1993-03-01), Kawakami et al.
patent: 5364011 (1994-11-01), Baker et al.

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