Controlled temperature hot melt adhesive dispensing system

Dispensing – Automatic control – Temperature responsive or soluble controller

Patent

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Details

2221465, 219230, 219308, 219486, 264 406, 425143, B67D 562

Patent

active

046001247

ABSTRACT:
A controlled temperature hot melt adhesive dispensing system including three closed loop temperature control arrangements along a flow path for hot melt adhesive extending from an upstream adhesive source to a downstream adhesive dispenser. As disclosed, each closed loop temperature control arrangement includes a comparator which compares the temperature sensed by a temperature sensor with a setpoint temperature to produce a control signal for a heater in the temperature control arrangement. The temperature control loops are located along the adhesive flow path so that the second closed loop temperature controller is upstream from the first closed loop temperature controller; and the third closed loop temperature controller is upstream from both the first and second temperature controllers. A first feedback circuit scales and integrates the control signal from the first location to produce a first feedback circuit output which adjusts the setpoint temperature at the second location. A second feedback circuit scales and integrates the control signal from the second location to produce a second feedback output which adjusts the third setpoint temperature. In this way, the three closed loop temperature control arrangements are cascaded so that the control signals developed are coupled, directly or indirectly, to each upstream closed loop temperature control arrangement.

REFERENCES:
patent: 3733059 (1973-05-01), Pettit
patent: 4094940 (1978-06-01), Hold
patent: 4197070 (1980-04-01), Koschmann
patent: 4272466 (1981-06-01), Harris

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