Controlled solder oxidation process

Details Controlled solder oxidation process Controlled solder oxidation process

1991-04-01

1992-10-06

Seidel, Richard K.

Metal fusion bonding

Process

Plural joints

228223, 228215, B23K 3102

Patent

active

051524511

ABSTRACT:
A method of soldering leadless components to a printed circuit board without using solder paste is disclosed. A thick layer of solder (42) is plated onto a printed circuit board (40), and an oxide layer (43) is formed by heating. Solder flux (45) is applied to those solder pads that are intended to be reflowed, and components (54) are placed. The printed circuit board is heated, and a solder joint (68) is effected between the components (54) and the circuit board (40), while the unfluxed solder pads (66) do not reflow and remain flat. Solder flux is then applied to the remaining solder pads (66) on the same or the opposite side of the circuit board. Additional components (77) are placed, and the circuit board (40) is reflowed a second time.

REFERENCES:
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 4081901 (1978-04-01), Miller
patent: 4196839 (1980-04-01), Davis
patent: 4598858 (1986-07-01), Stratil et al.
patent: 4719134 (1988-01-01), Ely
patent: 4865245 (1989-09-01), Schulte et al.
patent: 4925522 (1990-05-01), Avellino et al.
IBM Tech. Dis. Bull. "Solder Stop For Contact Pin", vol. 10, No. 1 Jun. 1967 p. 7.
Fluxless SMD Soldering, Circuits Manufacturing, Oct. 1984.

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