Controlled reflectance of sputtered aluminum layers

Details Controlled reflectance of sputtered aluminum layers Controlled reflectance of sputtered aluminum layers

1977-08-15

1978-11-14

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204192C, C23C 1500

Patent

active

041254465

ABSTRACT:
A method for depositing aluminum layers having a predetermined reflectance or a predetermined resistivity is disclosed. The layers are deposited by sputtering a target comprising 90% or greater aluminum. The parameters which must be controlled include the partial pressure of reactive gases, such as nitrogen, hydrogen, oxygen and water vapor, which are minor constituents of the sputtering gas, the total sputtering gas pressure, the substrate temperature, and the deposition rate.

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L. D. Hartsough and P. S. McLeod, "High-Rate Sputtering of Enhanced Aluminum Mirrors," Journal of Vac. Sci. Technol., vol. 14, No. 1, pp. 123-126.

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