Controlled lapping for an ABS damascene process

Details Controlled lapping for an ABS damascene process Controlled lapping for an ABS damascene process

2008-02-25

2011-12-27

Banks, Derris (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603070, C029S603100, C029S603120, C029S603150

Reexamination Certificate

active

08082658

ABSTRACT:
Methods of lapping rows of recording heads are described after an air bearing surface (ABS) damascene process is performed. The ABS damascene process uses a selective etching process to form voids in the row of recording heads where conductive material forms a feature in the recording head, such as a wrap around shield. The conductive material is then deposited on the ABS of the row to fill the voids, and the row is lapped. According to methods provided herein, the resistance of one or more lapping guides in the row of recording heads is monitored to determine when the conductive material is removed by the lapping process. When the monitored resistance indicates that the conductive material is removed, the lapping process is stopped. The resistance across one or more lapping guides may also be used to control the lapping process to uniformly lap the conductive material from the ABS.

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