Controlled impedance connector

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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439493, H01R 2368

Patent

active

048955230

ABSTRACT:
A very high density, multiple contact connector has low-inductance power and ground planes and gold dot contacts for providing a controlled impedance environment to a module assembly by minimizing undesirable effects such as ground-noise and reflections while assuring operation at interconnect bandwidths up to 6 GHz. The controlled impedance connector connects two printed wiring boards (PWBs) comprising surface mounted devices to a motherboard. The PWBs are bonded to opposite sides of a central heat frame. The connector has two flexible circuits containing a total of 460 gold dot signal connections plus a plurality of separate gold dot power and ground connections. Signal runs between the PWBs and the connector flexible circuits are interconnected using copper fingers soldered to pads on the PWBs. Power and ground planes connect to the PWBs via gold dot contacts on the inside of the flexible circuit surface to pads on the PWBs. The connector is a true zero insertion force design. A clamping mechanism comprising jacking screws pulls the spring-loaded gold dots on the flexible circuit of the connector against the pads on a motherboard. A clamping force of 200 pounds is used to achieve the required connector to motherboard interconnect pressure.

REFERENCES:
patent: 3177103 (1965-04-01), Tally et al.
patent: 3466206 (1969-09-01), Beck
patent: 3701964 (1972-10-01), Cronin
patent: 3740698 (1973-06-01), Jerominek
patent: 4012093 (1977-03-01), Crane
patent: 4125310 (1978-11-01), Reardon, II
patent: 4453795 (1984-06-01), Moulin
patent: 4744764 (1988-05-01), Rubenstein
patent: 4798541 (1989-01-01), Porter
IBM Bulletin, Abbatecola, vol. 10, No. 10, p. 1462, 3-1968.

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