Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1988-11-07
1990-01-23
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439493, H01R 2368
Patent
active
048955230
ABSTRACT:
A very high density, multiple contact connector has low-inductance power and ground planes and gold dot contacts for providing a controlled impedance environment to a module assembly by minimizing undesirable effects such as ground-noise and reflections while assuring operation at interconnect bandwidths up to 6 GHz. The controlled impedance connector connects two printed wiring boards (PWBs) comprising surface mounted devices to a motherboard. The PWBs are bonded to opposite sides of a central heat frame. The connector has two flexible circuits containing a total of 460 gold dot signal connections plus a plurality of separate gold dot power and ground connections. Signal runs between the PWBs and the connector flexible circuits are interconnected using copper fingers soldered to pads on the PWBs. Power and ground planes connect to the PWBs via gold dot contacts on the inside of the flexible circuit surface to pads on the PWBs. The connector is a true zero insertion force design. A clamping mechanism comprising jacking screws pulls the spring-loaded gold dots on the flexible circuit of the connector against the pads on a motherboard. A clamping force of 200 pounds is used to achieve the required connector to motherboard interconnect pressure.
REFERENCES:
patent: 3177103 (1965-04-01), Tally et al.
patent: 3466206 (1969-09-01), Beck
patent: 3701964 (1972-10-01), Cronin
patent: 3740698 (1973-06-01), Jerominek
patent: 4012093 (1977-03-01), Crane
patent: 4125310 (1978-11-01), Reardon, II
patent: 4453795 (1984-06-01), Moulin
patent: 4744764 (1988-05-01), Rubenstein
patent: 4798541 (1989-01-01), Porter
IBM Bulletin, Abbatecola, vol. 10, No. 10, p. 1462, 3-1968.
Morrison Brian D.
Rosenberg Jack J.
Abrams Neil
Dawson Walter F.
Raytheon Company
Sharkansky Richard M.
LandOfFree
Controlled impedance connector does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Controlled impedance connector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Controlled impedance connector will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-643329