Controlled highly densified diamond packing of thermally conduct

Details Controlled highly densified diamond packing of thermally conduct Controlled highly densified diamond packing of thermally conduct

1991-07-31

1992-08-25

Flanigan, Allen J.

Heat exchange

Heat transmitter

524424, F28F 700, H01L 2334

Patent

active

051410508

ABSTRACT:
The invention provides a system and method for fabricating an electrically resistive, high density diamond-packed thermal conduit for electrical components. An exemplary conduit provides superior thermal transfer between two objects. This is achieved by establishing, within a flowable and highly shrinkable electrically insulative carrier medium such as acrylic, intimate contact between diamond particles preferably having an aspect ratio of 1.35 or less.

REFERENCES:
patent: 4602125 (1986-07-01), West et al.
patent: 4654752 (1987-03-01), Daszkowski
patent: 4685987 (1987-08-01), Fick
patent: 4782893 (1988-11-01), Thomas
patent: 4838347 (1989-06-01), Dentini et al.
patent: 4852646 (1989-08-01), Dittmer et al.

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