Controlled height and flow rework nozzle

Details Controlled height and flow rework nozzle Controlled height and flow rework nozzle

2007-07-03

2007-07-03

Estrada, Angel R. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

C174S0170VA, C174S520000, C174S547000, C361S676000, C361S689000, C361S688000

Reexamination Certificate

active

11007930

ABSTRACT:
An improved rework nozzle includes an open housing which when lowered onto the surface of a board forms a closed cavity. The housing includes venting means which expend air that is input to the cavity, thereby using flow through concepts to maintain a uniform temperature in the cavity. The housing also positioning mechanisms for both aligning a the housing and a captive integrated circuit to a desired footprint on the circuit board, and for limiting movement of the integrated circuit during rework.

REFERENCES:
patent: 6081425 (2000-06-01), Cheng
patent: 6236569 (2001-05-01), McEuen
patent: 6343012 (2002-01-01), Rife

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