Controlled fracture substrate singulation

Details Controlled fracture substrate singulation Controlled fracture substrate singulation

2006-02-28

2006-02-28

Lee, Hsien-Ming (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S110000, C438S113000, C438S460000, C438S463000

Reexamination Certificate

active

07005317

ABSTRACT:
Methods and apparatus for separating dice from a substrate are described herein.

REFERENCES:
patent: 6429506 (2002-08-01), Fujii et al.
patent: 6596562 (2003-07-01), Maiz

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