Controlled epoxy dispensing technique as related to transistor c

Fluent material handling – with receiver or receiver coacting mea – Miscellaneous

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118401, 156578, B67D 100, G01F 1100

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active

039331873

ABSTRACT:
Apparatus and method for the uniform dispensing of a conductive epoxy binder in hybrid microcircuit applications. A method is disclosed of uniformly pressurizing a conductive epoxy binder through a small orifice until a droplet of fixed volume forms, setting a predetermined gap size between a contact pad and the droplet in order to control the shape and size of the epoxy droplet left on the pad as the droplet touches it, and then releasing the pressure while reciprocating the dispenser from the pad. Also, apparatus, including a cylindrical limiting means attached to the dispenser tip, is disclosed for ensuring the gap size is constant. Other embodiments of the limiting means provide for the use of a relieved section which assists in preventing contamination and for adjusting means operable to vary the gap size.

REFERENCES:
patent: 2398985 (1946-04-01), Melch
patent: 2678557 (1954-05-01), Black
patent: 3495635 (1970-02-01), Touinou
patent: 3572400 (1971-03-01), Casner et al.
patent: 3661679 (1972-05-01), Lau
patent: 3744681 (1973-07-01), Morane
patent: 3810779 (1974-05-01), Pickett et al.

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