Controlled electroless plating

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

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106 127, 4274431, C23C 1834, C23C 1840

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active

052039110

ABSTRACT:
A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.

REFERENCES:
patent: 3431120 (1969-03-01), Weisenberger
Mallory, G. O. and Haidu, J. B., eds. Electroless Plating: Fundamentals and Applications (American Electro-Platers and Surface Finishers Society, Orlando, FL 1990, pp. 88-89).
Duffek, E. F; Baudrand, D. W.; Donaldson, J. G., Electroess Plating: Fundamentals and Applications, (American Electroplaters and Surface Finishers Society Orlando, FL 1990, p. (253).
Subramanian, R.; Selvam, M. Srinivasan, K. N., Bulletin of Electrochemistry, 4, 25 (1988).
Petukhov, I. V.; Kuznetsova, E. V.; Journal of Applied Chemistry of the USSR (Eng. Trans.), 1989, 62(9), pp. 1999-2000.
Rust, R. D., Printed Circuit Fabrication, Jun. 1987, pp. 37-44.
Chang, Y. S.; Lee, J. Y., Proceedings of the International Electronic Devices and Materials Symposium, Taiwan, 1984 p. 491.
Chang, Y. S.; Hsieh, J; Chen, H., Journal of Applied Physics, 65, 154 (1989).
Chang, Y. S.; Chou, M. L., Materials Chemistry and Physics, 24, 131 (1989).

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