Metal fusion bonding – Process – Plural joints
Patent
1988-11-21
1990-01-09
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228212, 228242, 228 62, 228 447, 228243, 269903, 269 21, B23K 3102, B23K 3704
Patent
active
048922455
ABSTRACT:
Disclosed is a system and method for controlled compression furnace bonding of a semiconductor chip to conductive elements of a leadframe. The system comprises a holding member having a chip support surface for supporting a semiconductor chip and a positioning system for precisely positioning conductive elements of a leadframe with corresponding bonding locations on the semiconductor chip. A furnace heating system comprising a furnace is employed for heating and bonding the conductive elements to the chip bonding locations. The method invention comprises positioning a semiconductor chip comprising a plurality of bonding locations in a holding member with a chip support surface; providing performed bonding material for connecting conductive elements of a leadframe with the chip bonding locations; aligning the conductive elements of a leadframe with corresponding bonding locations on the semiconductor chip; moving the leadframe conductive elements toward the chip bonding locations so that the bonding material is aligned with the conductive elements in the chip bonding locations; furnace bond heating the bonding material to a point of reflow; and cooling the bonding material to complete the bonding process between the leadframe conductive elements and the corresponding chip bonding locations.
REFERENCES:
patent: 3516155 (1970-06-01), Smith
patent: 3614832 (1971-10-01), Chance et al.
patent: 3692225 (1972-09-01), Lincoln
patent: 3723053 (1973-03-01), Myers et al.
patent: 3744650 (1973-07-01), Henebry et al.
patent: 3811829 (1974-05-01), Wesson et al.
patent: 4607779 (1986-08-01), Burns
patent: 4638938 (1987-01-01), Yarne et al.
patent: 4646435 (1987-03-01), Grassauer
Balgaard Luverne O.
Dicks Lori A.
Dunaway Thomas J.
Loy Jerald M.
Speilberger Richard K.
Godici Nicholas P.
Heinrich Samuel M.
Honeywell Inc.
Udseth W. T.
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