Controlled composite deposition method

Details Controlled composite deposition method Controlled composite deposition method

1992-11-05

1993-11-30

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating contains embedded solid material

427437, C25D 1500

Patent

active

052661814

ABSTRACT:
A composite deposit in which insoluble particles are co-deposited and dispersed in a metal matrix is formed on an article by dipping the article in a metal plating solution having insoluble particles dispersed therein and effecting an electroplating or chemical plating process. By adjusting the specific surface area of insoluble particles to be dispersed in the metal plating solution, the amount of insoluble particles co-deposited in the composite deposit can be controlled. Better results are obtained with insoluble particles having a specific surface area of 10 m.sup.2 /g or less.

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