Controlled collapse thermocompression gang bonding

Details Controlled collapse thermocompression gang bonding Controlled collapse thermocompression gang bonding

1987-11-16

1988-07-05

Ramsey, Kenneth J.

Metal fusion bonding

Process

With shaping

2281802, 357 70, H01L 2158

Patent

active

047549122

ABSTRACT:
Controlled shape bumps are fabricated into the metal contact fingers that are to be used in the gang bonding assembly of semiconductor devices. The bump shape permits the gang bonding of a plurality of contact fingers simultaneously while producing reliable, uniformly high strength bonds.

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