Controlled boron doping of silicon

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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148187, H01L 21385

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046768475

ABSTRACT:
A technique is described for doping a silicon body with boron. The surface to be doped is typically a trench sidewall, to be used as a storage capacitor or for isolation. By providing a silicon dioxide diffusion control layer, and a polysilicon source layer that incorporates the boron, well-controlled boron doping over a wide concentration range can be obtained. Control of the doping transfer can be obtained by the choice of ambients, either dry or steam. Furthermore, removal of the silicon dioxide and polysilicon layers following the doping process is facilitated due to the etch selectivity possible between SiO.sub.2 and Si. If desired, the layers may remain on the silicon body.

REFERENCES:
patent: 3066052 (1962-11-01), Howard
patent: 3928095 (1975-12-01), Harigaya et al.
patent: 4332076 (1982-06-01), de Zaldivar
patent: 4353086 (1982-10-01), Jaccodine et al.
patent: 4471524 (1984-09-01), Kinsbron et al.
patent: 4472212 (1984-09-01), Kinsbron
patent: 4502202 (1985-03-01), Malhi
patent: 4502894 (1985-03-01), Seto et al.
patent: 4507849 (1985-04-01), Shinozaki
patent: 4534824 (1985-08-01), Chen
patent: 4545114 (1985-10-01), Ito et al.
patent: 4549914 (1985-10-01), Oh
patent: 4569701 (1986-02-01), Oh
patent: 4581319 (1986-04-01), Wieder et al.
Grove et al., Journal of Applied Physics, vol. 35, No. 9, Sep. 1964, pp. 2695-2701.
"The Oxidation Rate Dependence of Oxidation-Enhanced Diffusion of Boron and Phosphorus in Silicon", J. Electrochem. Soc.: Solid-State Science and Technology, Lin et al., May 1981, pp. 1131-1137.
"A High Performance, High Density 256K DRAM Utilizing 1X Projection Lithography", International Electron Devices Meeting, E. Adler et al., Dec. 5-7, 1983, pp. 327-330.
"Diffusion of Boron from Implanted Sources under Oxidizing Conditions", J. Electrochem. Soc.: Solid-State Science and Technology, J. L. Prince et al., vol. 121, No. 5, May 1974, pp. 705-710.
"A Corrugated Capacitor Cell (CCC)", IEEE Transactions on Electron Devices, vol. ED-31, No. 6, Sunami et al., Jun. 1984, pp. 746-763.
"A New Bipolar Process-Borsenic", IEEE Journal of Solid-State Circuits, vol. SC-11, No. 4, Saraswat et al., Aug. 1976, pp. 495-500.
"Diffusivity Summary of B,Ga,P,As, and Sb in SiO.sub.2 ", J. Electrochem. Soc.: Solid-State Science and Technology, M. Ghezzo and D. M. Brown, Jan. 1973, pp. 146-148.

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